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NSI45035JZ, NSV45035JZ
http://onsemi.com
2
MAXIMUM RATINGS (T
A
 = 25癈 unless otherwise noted)
Rating
Symbol
Value
Unit
AnodeCathode Voltage
Vak Max
45
V
Reverse Voltage
V
R
500
mV
Operating and Storage Junction Temperature Range
T
J
, T
stg
55 to +150
癈
ESD Rating:
Human Body Model
Machine Model
ESD
Class 2
Class C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (T
A
 = 25癈 unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Steady State Current @ Vak = 7.5 V (Note 1)
I
reg(SS)
29.75
35
40.25
mA
Voltage Overhead (Note 2)
V
overhead
1.8
V
Pulse Current @ Vak = 7.5 V (Note 3)
I
reg(P)
30.9
42.5
mA
Capacitance @ Vak = 7.5 V (Note 4)
C
7.4
pF
Capacitance @ Vak = 0 V (Note 4)
C
31
pF
1.  I
reg(SS)
 steady state is the voltage (Vak) applied for a time duration e 35 sec, using FR4 @ 300 mm
2
 2 oz. Copper traces, in still air.
2.  V
overhead
 = V
in
  V
LEDs
. V
overhead
 is typical value for 75% I
reg(SS)
.
3.  I
reg(P)
 nonrepetitive pulse test. Pulse width t d 1.0 msec.
4.  f = 1 MHz, 0.02 V RMS.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation (Note 5) T
A
 = 25癈
 Derate above 25癈
P
D
1008
8.06
mW
mW/癈
Thermal Resistance, JunctiontoAmbient (Note 5)
R
?SPAN class="pst NSI45035JZT1G_2645254_5">JA
124
癈/W
Thermal Reference, JunctiontoLead 4 (Note 5)
R
?SPAN class="pst NSI45035JZT1G_2645254_5">JL4
33.3
癈/W
Total Device Dissipation (Note 6) T
A
 = 25癈
 Derate above 25癈
P
D
1136
9.09
mW
mW/癈
Thermal Resistance, JunctiontoAmbient (Note 6)
R
?SPAN class="pst NSI45035JZT1G_2645254_5">JA
110
癈/W
Thermal Reference, JunctiontoLead 4 (Note 6)
R
?SPAN class="pst NSI45035JZT1G_2645254_5">JL4
33.3
癈/W
Total Device Dissipation (Note 7) T
A
 = 25癈
 Derate above 25癈
P
D
1238
9.9
mW
mW/癈
Thermal Resistance, JunctiontoAmbient (Note 7)
R
?SPAN class="pst NSI45035JZT1G_2645254_5">JA
101
癈/W
Thermal Reference, JunctiontoLead 4 (Note 7)
R
?/DIV>
JL4
33.7
癈/W
Total Device Dissipation (Note 8) T
A
 = 25癈
 Derate above 25癈
P
D
1420
11.36
mW
mW/癈
Thermal Resistance, JunctiontoAmbient (Note 8)
R
?SPAN class="pst NSI45035JZT1G_2645254_5">JA
88
癈/W
Thermal Reference, JunctiontoLead 4 (Note 8)
R
?SPAN class="pst NSI45035JZT1G_2645254_5">JL4
32.1
癈/W
Total Device Dissipation (Note 9) T
A
 = 25癈
 Derate above 25癈
P
D
1316
10.53
mW
mW/癈
Thermal Resistance, JunctiontoAmbient (Note 9)
R
?SPAN class="pst NSI45035JZT1G_2645254_5">JA
95
癈/W
Thermal Reference, JunctiontoLead 4 (Note 9)
R
?/DIV>
JL4
32.4
癈/W
Total Device Dissipation (Note 10) T
A
 = 25癈
 Derate above 25癈
P
D
1506
12.05
mW
mW/癈
Thermal Resistance, JunctiontoAmbient (Note 10)
R
?SPAN class="pst NSI45035JZT1G_2645254_5">JA
83
癈/W
Thermal Reference, JunctiontoLead 4 (Note 10)
R
?SPAN class="pst NSI45035JZT1G_2645254_5">JL4
30.8
癈/W
Junction and Storage Temperature Range
T
J
, T
stg
55 to +150
癈
NOTE: Lead measurements are made by noncontact methods such as IR with treated surface to increase emissivity to 0.9.
Lead temperature measurement by attaching a T/C may yield values as high as 30% higher 癈/W values based upon empirical
measurements and method of attachment.
5.  FR4 @ 300 mm
2
, 1 oz. copper traces, still air.
6.  FR4 @ 300 mm
2
, 2 oz. copper traces, still air.
7.  FR4 @ 500 mm
2
, 1 oz. copper traces, still air.
8.  FR4 @ 500 mm
2
, 2 oz. copper traces, still air.
9.  FR4 @ 700 mm
2
, 1 oz. copper traces, still air.
10.FR4 @ 700 mm
2
, 2 oz. copper traces, still air.
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